TPS62125DSGR Texas Instruments IC REG BUCK ADJ 0.3A SYNC 8WSON

label:
2024/01/16 349



• Wide Input Voltage Range 3 V to 17 V
• Input Supply Voltage Supervisor (SVS) With Adjustable Threshold and Hysteresis Consuming Typical 6-µA Quiescent Current
• Wide Output Voltage Range 1.2 V to 10 V
• Typical 13-µA Quiescent Current
• 350-nA Typical Shutdown Current
• Seamless Power Save Mode Transition
• DCS-Control™ Scheme
• Low Output Ripple Voltage
• Up to 1-MHz Switching Frequency
• Highest Efficiency over Wide VIN and VOUT Range
• Pin to Pin Compatible with TPS62160/70
• 100% Duty Cycle Mode
• Power Good Open Drain Output
• Output Discharge Function
• Small 2-mm × 2-mm 8-pin WSON Package


CATALOG
TPS62125DSGR PARAMETRIC INFO
TPS62125DSGR PACKAGE INFO
TPS62125DSGR MANUFACTURING INFO
TPS62125DSGR PACKAGING INFO
TPS62125DSGR ECAD MODELS
TPS62125DSGR APPLICATIONS


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 3
Maximum Input Voltage (V) 17
Output Voltage (V) 1.2 to 10
Maximum Output Current (A) 0.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Regulation Condition Change In Line 12V
Switching Frequency (kHz) 1000
Switching Regulator Yes
Operating Supply Voltage (V) 3 to 17
Output Type Adjustable
Tradename DCS-Control™
Load Regulation -0.004%mA(Typ)
Line Regulation -0.05%/V(Typ)
Typical Quiescent Current (uA) 13
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Switch Current (A) 0.75


PACKAGE INFO
Supplier Package WSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 2.1(Max)
Package Width (mm) 2.1(Max)
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.1(Max)
Package Overall Width (mm) 2.1(Max)
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name SON
Jedec MO-229


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7.09
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Embedded Processing
• 4-Cell Alkaline, 1- to 4-Cell Li-Ion Battery-Powered Applications
• 9-V to 15-V Standby Power Supply
• Energy Harvesting
• Inverter (Negative VOUT)

Produkt RFQ