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• Wide Input Voltage Range 3 V to 17 V
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• Input Supply Voltage Supervisor (SVS) With
Adjustable Threshold and Hysteresis Consuming
Typical 6-µA Quiescent Current
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• Wide Output Voltage Range 1.2 V to 10 V
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• Typical 13-µA Quiescent Current
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• 350-nA Typical Shutdown Current
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• Seamless Power Save Mode Transition
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• DCS-Control™ Scheme |
• Low Output Ripple Voltage |
• Up to 1-MHz Switching Frequency |
• Highest Efficiency over Wide VIN and VOUT Range
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• Pin to Pin Compatible with TPS62160/70 |
• 100% Duty Cycle Mode |
• Power Good Open Drain Output |
• Output Discharge Function |
• Small 2-mm × 2-mm 8-pin WSON Package |
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CATALOG |
TPS62125DSGR PARAMETRIC INFO
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TPS62125DSGR PACKAGE INFO
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TPS62125DSGR MANUFACTURING INFO
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TPS62125DSGR PACKAGING INFO
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TPS62125DSGR ECAD MODELS
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TPS62125DSGR APPLICATIONS
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PARAMETRIC INFO
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Type |
Synchronous Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
3 |
Maximum Input Voltage (V) |
17 |
Output Voltage (V) |
1.2 to 10 |
Maximum Output Current (A) |
0.3 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Regulation Condition Change In Line |
12V |
Switching Frequency (kHz) |
1000 |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
3 to 17 |
Output Type |
Adjustable |
Tradename |
DCS-Control™ |
Load Regulation |
-0.004%mA(Typ) |
Line Regulation |
-0.05%/V(Typ) |
Typical Quiescent Current (uA) |
13 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical Switch Current (A) |
0.75 |
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PACKAGE INFO
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Supplier Package |
WSON EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
No Lead |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
2.1(Max) |
Package Width (mm) |
2.1(Max) |
Package Height (mm) |
0.75(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2.1(Max) |
Package Overall Width (mm) |
2.1(Max) |
Package Overall Height (mm) |
0.8(Max) |
Seated Plane Height (mm) |
0.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
Package Family Name |
SON |
Jedec |
MO-229 |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7.09 |
Reel Width (mm) |
8.4 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Embedded Processing
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• 4-Cell Alkaline, 1- to 4-Cell Li-Ion Battery-Powered
Applications
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• 9-V to 15-V Standby Power Supply
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• Energy Harvesting
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• Inverter (Negative VOUT)
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